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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : Preliminary Data Issued Date : 2000.04.15 Revised Date : 2000.04.20 Page No. : 1/3
HSMA400X Series
1.0AMP. SURFACE MOUNT RECTIFIERS
Features
* For surface mounted application * Low forward voltage drop * High current capability * Easy pick and place * High surge current capability * Plastic material used carries Underwriters Laboratory Classification 94V-0 * High temperature soldering: 250C/10 seconds at terminals
Mechanical Data
* Case: SMA/DO-214AC Molded Plastic. * Terminals: Solder plated. * Polarity: Indicated by cathode band. * Packaging: 12mm tape per EIA STD RS-481. * Weight: 0.064 gram.
Maximum Ratings and Electrical Characteristics
Rating at 25C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. HSMA HSMA HSMA HSMA HSMA HSMA HSMA Type Number Units 4001 4002 4003 4004 4005 4006 4007 Maximum Recurrent Peak Reverse Voltage 50 100 200 400 600 800 1000 V Maximum RMS Voltage 35 70 140 280 420 560 700 V Maximum DC Blocking Voltage 50 100 200 400 600 800 1000 V Maximum Average 1 A Forward Rectified Current @TL=110C Peak Forward Surge Current, 8.3ms Single Half Sine-wave Superimposed on 30 A Rated Load(JEDEC method) Maximum Instantaneous 1.1 V Forward Voltage @ 1.0A 5(@Ta=25C) Maximum DC Reverse Current at uA Rated DC Blocking Voltage 50(@Ta=125C) Maximum Reverse Recovery Time (Note 1) 1.8 uS Typical Junction Capacitance (Note 2) 12 pF Operating Temperature Range Tj -55 to +150 C Storage Temperature Range Tstg -55 to +150 C Note1: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A Note2: Measured at 1 MHz and Applied VR=4.0Volts
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : Preliminary Data Issued Date : 2000.04.15 Revised Date : 2000.04.20 Page No. : 2/3
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
SMA/DO-214AC Dimension
Spec. No. : Preliminary Data Issued Date : 2000.04.15 Revised Date : 2000.04.20 Page No. : 3/3
A
B
C
D
H E F G
*:Typical
DIM A B C D
Inches Min. Max. 0.5000 0.0642 0.0901 0.1150 0.1575 0.1811 0.0783 0.1028
Millimeters Min. Max. 1.27 1.63 2.29 2.92 4.00 4.60 1.99 2.61
DIM E F G H
Inches Min. Max. 0.0299 0.0598 0.0039 0.0079 0.1890 0.2201 0.0059 0.0122
Millimeters Min. Max. 0.76 1.52 0.10 0.20 4.80 5.59 0.15 0.31
Notes : 1.Dimension and tolerance based on our Spec. dated Mar. 6,1995.
2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
* Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
* Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 * Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220
HSMC Product Specification

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